TOUGHBOOK Innovation Forum

Features TOUGHBOOK Innovation Forum

Get a Sneak Preview of Upcoming Toughbook DevicesThe Toughbook Innovation Forum is designed to: provide you with an opportunity to learn what is new in technology and in your industry, share and discuss best practices, and network with other organizations in your region.
There will be presentations from Intel and Microsoft on upcoming developments and a chance to learn about the full infrastructure available to support mobility initiatives in your organization.
During industry breakouts you will hear customers share their experiences, and you can join roundtable discussions to explore where new technologies can be maximized.
If you attend one conference this year, the TIF will help you stay ahead on what's coming next.